| HTS Code |
84864029.00 |
84864022.00 |
| Article Description |
Other machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or electronic integrated circuits |
Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices) |
| Unit of Quantity(I/II) |
set/kilogram |
set/kilogram |
| MFN (Most-favored Nation) |
0 |
0 |
| Gen (General Tariff Rate) |
17% |
30% |
| Provisional Import tariff |
- |
- |
| Export tariff |
- |
- |
| Export Tax Rebate |
13% |
13% |
| TaxVAT (Value-added Tax) |
13% |
13% |
| Consumption Tax |
0% |
0% |
| Regulations & Restrictions |
-- |
-- |
| Inspection & Quarantine |
-- |
-- |
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